Esisar rubrique Formation 2022

Signal Integrity in Digital and RF Systems - 5AMSC514

  • Number of hours

    • Lectures 12.0
    • Tutorials 6.0
    • Laboratory works 9.0


    ECTS 2.5


The objective of this course is to introduce students to the topic of signal integrity of RF and digital components.

To be able to understand the major trends in the development of integration technologies of electronic circuits (ICs and RF circuits)
To be able to improve signal integrity in electronic circuits (ICs and RF circuits).
To be able to implement techniques to characterize, to measure the performance of RF or digital components.
To be able to choose materials, substrates (dielectrics, conducting material…) according to their physical properties to improve the performances of electronic systems.
To be able to understand and take into account the parasitic effects of interconnections and packaging in the circuit design (modeling elements, coupling EM ...).
To be able to model physical phenomena related to the increase of the operating frequency.

Contact Darine KADDOUR, Etienne PERRET


Part 1: Digital Signal Integrity in High-Speed – Signal Analysis in Time Domain

1. Introduction: The Importance of Signal Integrity
2. Technologies - Basic Transmission Lines in Electronic Packaging
3. Substrates and Materials
4. Transmission-line Reflections
5. Crosstalk

Part 2: : RF Signal Integrity – Signal Analysis in Frequency Domain
6. Basics of RF electronics
7. Vector network analyzer
8. Calibration techniques
9. De-embedding techniques
10. Transmission line characterization
11. Material characterization


  • Time Domain Reflectometry : TDR (Lab in Grenoble) : Study of interconnect lines for sub-nanosecond circuits by time domain reflectometry
  • RF Component Characterization – Signal Analysis in Time Domain
  • RF Component Characterization – Signal Analysis in Frequency Domain


Electromagnetics, Concepts in Radio Frequency transmission media, Guides and electromagnetic radiation, Basics of radio frequency circuits and systems, Basics of Microwave Circuit ia, Guides and electromagnetic radiation, radio frequency circuits and systems, antennas



E1 = Final Exam 1 - 1H30, Undocumented, No calculator
E2 = Final Exam 2 - resit/rattrapage examination - 1H30, Undocumented, No calculator
TP = Lab

N1 = 60%E1 + 40%TP.
N2 = 60%E2 + 40%TP.

Additional Information

Curriculum->EIS ->Semester 5
Curriculum->EIS (Apprenticeship)->Semester 5


• Books
o Hall, Heck, « Advanced Signal Integrity for High-Speed Digital Designs », Wiley-IEEE Press, 2009.
o Vasseur, « Environnement Hyperfrequence », Cours en ligne,
o Gupta, « Microstrip Lines and Slotlines », 2nd édition, Artech House Publishers,1996.
o Gardiol, « Electromagnétisme », Traité d’électricité, Volume 3, Presses Polytechniques et universitaires Romandes, 1996.
o Zheng, « Electronic System Packaging 2B 1450 », Cours en ligne.
o Hall, « High-Speed Digital System Design », Wiley Publishers, ISBN: 0-471-36090-2.
o Tummala, « Fundamentals of Microsystems Packaging », McGraw-Hill
o Huynen - D. Vanhoenacker-Janvier, « ELEC 2700 Hyperfréquences », Cours en ligne.
o Nadgijimana, « Intégrité du signal, compatibilité électromagnétique dans les interconnexions haut débit », ISTE, 2014.
o Pozar, « Microwave Engineering », Wiley, 2011.
• Application notes :
o Advanced Calibration Techniques for Vector Network Analyzers, Agilent.
o The ABCs of De-embedding, Agilent.
o Network analyzer basics, David Ballo,Helwet Packard
• Articles :
o Mubarak et all, « Characterising cable flexure effects in s-parameters measurements », Microwave Measurement Conference, 2013.